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datashee t 1/27 ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 14 ? 001 tsz02201-0rfr0g200680-1-2 30.jan.2014 rev.001 comparator ground sense comparators ba2903yf-lb BA2901YF-LB general description this is the product guarantees long time support in industrial market. ba2903yf-lb and BA2901YF-LB are open collector output comparators that c an operate in single power supply. it features wide operating voltage range of 2v to 36v and with low supply current. features ? long time support a product for industrial applications ? single or dual power supply operation ? wide operating supply voltage ? standard comparator pin-assignments ? common-mode input voltage range includes ground level. ? wide temperature range key specifications ? operating supply voltage range single supply : +2.0v to +36v split supply : 1.0v to 18v ? supply current ba2903yf-lb(dual) 0.6ma(typ) BA2901YF-LB(quad) 0.8ma(typ) ? input bias current : 50na(typ) ? input offset current : 5na(typ) ? operating temperature range : -40c to +125c packages w(typ) x d(typ) x h(max) sop8 5.00mm x 6.20mm x 1.71mm sop14 8.70mm x 6.20mm x 1.71mm application ? industrial equipment ? current monitor ? battery monitor ? multivibrators simplified schematic product structure : silicon monolithic integrated circuit this product has no designed protec tion against radioactive rays figure 1. simplified schematic (one channel only) +in -in out vcc vee
tsz02201-0rfr0g200680-1-2 2/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 out2 out1 vcc -in1 +in1 -in2 +in2 out3 out4 vee +in4 -in4 +in3 -in3 1 2 3 4 5 6 78 9 10 11 12 13 14 ch1 ch3 ch2 ch4 pin configuration ba2903yf-lb : sop8 pin no. pin name 1 out1 2 -in1 3 +in1 4 vee 5 +in2 6 -in2 7 out2 8 vcc BA2901YF-LB : sop14 pin no. pin name 1 out2 2 out1 3 vcc 4 -in1 5 +in1 6 -in2 7 +in2 8 -in3 9 +in3 10 -in4 11 +in4 12 vee 13 out4 14 out3 package sop8 sop14 ba2903yf-lb BA2901YF-LB -+ + - ch1 ch2 8 1 2 3 4 5 6 7 out1 -in1 +in1 vee vcc out2 -in2 +in2
tsz02201-0rfr0g200680-1-2 3/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 ordering information b a 2 9 0 x y f - lb h2 part number ba2903yf ba2901yf package f : sop8 sop14 product class lb for industrial applications packaging and forming specification h2: embossed tape and reel (sop8/sop14) line-up topr operating supply voltage dual/quad package orderable part number -40c to +125c +2.0v to +36v dual sop8 reel of 250 ba2903yf-lbe2 quad sop14 reel of 250 BA2901YF-LBe2 absolute maximum ratings (t a =25c) parameter symbol ratings unit ba2903yf-lb BA2901YF-LB supply voltage vcc-vee +36 v power dissipation p d sop8 0.77 (note 1,3) - w sop14 - 0.56 (note 2,3) differential input voltage (note 4) v id +36 v input common-mode voltage range v icm (vee-0.3) to (vee+36) v input current (note 5) i i -10 ma operating supply voltage v opr +2.0 ~ +36 (1.0 ~ 18) v operating temperature range t opr -40 to +125 c storage temperature range t stg -55 to +150 c maximum junction temperature t jmax +150 c (note 1) to use at temperature above t a =25c reduce 6.2mw/c. (note 2) to use at temperature above t a =25c reduce 4.5mw/c. (note 3) mounted on a fr4 glass epoxy pcb 70mm70mm1.6mm (copper foil area less than 3%). (note 4) the voltage difference between inverting input and non-inverting input is the differential input voltage. then input terminal voltage is set to more than vee. (note 5) an excessive input current will flow when input voltages of less than vee-0.6v are applied. the input current can be set to less than the rated current by adding a limiting resistor. caution: operating the ic over the absolute maximum ratings may damage the ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a f use, in case the ic is operated over the absolute maximum ratings.
tsz02201-0rfr0g200680-1-2 4/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 electrical characteristics ba2903yf-lb (unless otherwis e specified vcc=+5v, vee=0v) parameter symbol temperature range limits unit conditions min typ max input offset voltage (note 6,7) v io 25c - 2 7 mv e k =-1.4v full range - - 15 vcc=5 to 36v, e k =-1.4v input offset current (note 6,7) i io 25c - 5 50 na e k =-1.4v full range - - 200 input bias current (note 7,8) i b 25c - 50 250 na e k =-1.4v full range - - 500 input common-mode voltage range v icm 25c 0 - vcc-1.5 v - large signal voltage gain (note 7) a v 25c 88 100 - db vcc=15v, e k =-1.4 to -11.4v r l =15k ? , v rl =15v full range 74 - - supply current (note 7) i cc 25c - 0.6 1 ma out=open full range - - 2.5 out=open, vcc=36v output sink current (note 9) i sink 25c 6 16 - ma +in=0v, -in=1v out=1.5v output saturation voltage (note 7) (maximum output voltage low) v ol 25c - 150 400 mv +in=0v, -in= 1v i sink =4ma full range - - 700 output leakage current (note 7) (high level output current) i leak 25c - 0.1 - a +in=1v, -in=0v out=5v full range - - 1 +in=1v, -in=0v out=36v response time t re 25c - 1.3 - s r l =5.1k ? , v rl =5v v in =100mv p-p , overdrive=5mv - 0.4 - r l =5.1k ? , v rl =5v, v in =ttl logic swing, v ref =1.4v (note 6) absolute value (note 7) full range t a =-40c to +125c (note 8) current direction: since first input stage is compos ed with pnp transistor, input bias current flows out of ic. (note 9) under high temperatures, please consider the power dissipation when selecting the output current. when the output terminal is continuously shorted th e output current reduces the internal temperature by flushing.
tsz02201-0rfr0g200680-1-2 5/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 BA2901YF-LB (unless otherwis e specified vcc=+5v, vee=0v) parameter symbol temperature range limits unit conditions min typ max input offset voltage (note10,11) v io 25c - 2 7 mv e k =-1.4v full range - - 15 vcc=5 to 36v, e k =-1.4v input offset current (note10,11) i io 25c - 5 50 na e k =-1.4v full range - - 200 input bias current (note11,12) i b 25c - 50 250 na e k =-1.4v full range - - 500 input common-mode voltage range v icm 25c 0 - vcc-1.5 v - large signal voltage gain (note11) a v 25c 88 100 - db vcc=15v, e k =-1.4 to -11.4v r l =15k ? , v rl =15v full range 74 - - supply current (note11) i cc 25c - 0.8 2 ma out=open full range - - 2.5 out=open, vcc=36v output sink current (note13) i sink 25c 6 16 - ma +in=0v, -in=1v out=1.5v output saturation voltage (note11) ( maximum output voltage low ) v ol 25c - 150 400 mv +in=0v, -in= 1v i sink =4ma full range - - 700 output leakage current (note11) ( high level output current ) i leak 25c - 0.1 - a +in=1v, -in=0v out=5v full range - - 1 +in=1v, -in=0v out=36v response time t re 25c - 1.3 - s r l =5.1k ? , v rl =5v v in =100mv p-p , overdrive=5mv - 0.4 - r l =5.1k ? , v rl =5v, v in =ttl logic swing, v ref =1.4v (note 10) absolute value (note 11) full range t a =-40c to +125c (note 12) current direction: since first input stage is compos ed with pnp transistor, input bias current flows out of ic. (note 13) under high temperatures, please consider the power dissipation when selecting the output current. when the output terminal is continuously shorted th e output current reduces the internal temperature by flushing.
tsz02201-0rfr0g200680-1-2 6/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 description of electrical characteristics described below are descriptions of the rele vant electrical terms used in this datasheet. items and symbols used are also shown. note that item name and symbol and their meaning ma y differ from those on another manufacturer?s document or general document. 1. absolute maximum ratings absolute maximum rating items indicate the condition which must not be exceeded. application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (1) supply voltage (vcc/vee) indicates the maximum voltage that can be applied between the vcc terminal and the vee terminal without deterioration or destruction of characteristics of internal circuit. (2) differential input voltage (v id ) indicates the maximum voltage that can be applied betw een non-inverting and inverting terminals without damaging the ic. (3) input common-mode voltage range (v icm ) indicates the maximum voltage that can be applied to the non-inverting and inverting terminals without deterioration or destruction of electrical characteristics. input common-mode voltage range of the maximum ratings does not assure normal operation of ic. for normal operation, use the ic within the input common-mode voltage range characteristics. (4) operating and storage temperature ranges (t opr , t stg ) the operating temperature range indicate s the temperature range within which the ic can operate. the higher the ambient temperature, the lower the po wer consumption of the ic. the storage temperature range denotes the range of temperatures the ic can be stored und er without causing excessive deterioratio n of the electrical characteristics. (5) power dissipation (p d ) indicates the power that can be consumed by the ic when mo unted on a specific board at the ambient temperature 25c (normal temperature). as for package product, p d is determined by the temperature that can be permitted by the ic in the package (maximum junction temperature) and the thermal resistance of the package. 2. electrical characteristics (1) input offset voltage (v io ) indicates the voltage difference between non-inverting termi nal and inverting terminals. it can be translated into the input voltage difference required for setting the output voltage at 0 v. (2) input offset current (i io ) indicates the difference of input bias current bet ween the non-inverting and inverting terminals. (3) input bias current (i b ) indicates the current that flows into or out of the input terminal. it is defined by the average of input bias currents at the non-inverting and inverting terminals. (4) input common-mode voltage range (v icm ) indicates the input voltage range where ic normally operates. (5) large signal voltage gain (a v ) indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. it is normally the amplifying rate (gain) with reference to dc voltage. a v = (output voltage) / (differential input voltage) (6) supply current (i cc ) indicates the current that flows within the ic under specified no-load conditions. (7) output sink current (i sink ) denotes the maximum current that can be ou tput under specific output conditions. (8) output saturation voltage, low level output voltage (v ol ) signifies the voltage range that can be out put under specific output conditions. (9) output leakage current, high level output current (i leak ) indicates the current that flows into the ic under specific input and output conditions. (10) response time (t re ) response time indicates the delay time between the i nput and output signal is determined by the time difference from the fifty percent of input signal swing to the fifty percent of output signal swing.
tsz02201-0rfr0g200680-1-2 7/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 typical performance curves ba2903yf-lb (*)the above characteristics are measurements of typical sample, they are not guaranteed. 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature [c] power dissipation [w] ba2903yf-lb 0 50 100 150 200 010203040 supply voltage [v] output saturation voltage [mv] -40 25 125 figure 3. supply current vs supply voltage figure 4. supply current vs ambient temperature figure 2. power dissipation vs ambient temperature (derating curve) figure 5. output saturation voltage vs supply voltage (i sink =4ma) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0 10203040 supply voltage [v] supply current [ma] 25 125 -40 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] supply current [ma] 2v 5v 36v
tsz02201-0rfr0g200680-1-2 8/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued ba2903yf-lb (*)the above characteristics are measurements of typical sample, they are not guaranteed. 0 10 20 30 40 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] output sink current [ma] 0 50 100 150 200 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] output saturation voltage [mv] 36v 5v 36v 5v 2v 2v figure 9. input offset voltage vs supply voltage figure 6. output saturation voltage vs ambient temperature (i sink =4ma) figure 7. output saturation voltage vs output sink current (vcc=5v) figure 8. output sink current vs ambient temperature (out=1.5v) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 02468101214161820 output sink current [m a] output saturation voltage [v] -40 25 125 -8 -6 -4 -2 0 2 4 6 8 010203040 supply voltage [v] input offset voltage [mv] -40 25 125
tsz02201-0rfr0g200680-1-2 9/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued ba2903yf-lb (*)the above characteristics are measurements of typical sample, they are not guaranteed. 0 20 40 60 80 100 120 140 160 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] input bias current [na] -50 -40 -30 -20 -10 0 10 20 30 40 50 0 10203040 supply voltage [v] input offset current [na] 125 25 -40 2v 5v -8 -6 -4 -2 0 2 4 6 8 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] input offset voltage [mv] 2v 5v 36v 36v 0 20 40 60 80 100 120 140 160 0 10203040 supply voltage [v] input bias current [na] -40 25 125 figure 10. input offset voltage vs ambient temperature figure 11. input bias current vs supply voltage figure 12. input bias current vs ambient temperature figure 13. input offset current vs supply voltage
tsz02201-0rfr0g200680-1-2 10/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued ba2903yf-lb (*)the above characteristics are measurements of typical sample, they are not guaranteed. 60 70 80 90 100 110 120 130 140 010203040 supply voltage [v] large signal voltage gain [db] -50 -40 -30 -20 -10 0 10 20 30 40 50 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] input offset current [na] 2v 5v 36v 25 125 -40 60 70 80 90 100 110 120 130 140 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] large signal voltage gain [db] 15v 5v 36v 40 60 80 100 120 140 160 010203040 supply voltage [v] common mode rejection ratio [db] -40 25 125 figure 15. large signal voltage gain vs supply voltage figure 14. input offset current vs ambient temperature figure 17. common mode rejection ratio vs supply voltage figure 16. large signal voltage gain vs ambient temperature
tsz02201-0rfr0g200680-1-2 11/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued ba2903yf-lb (*)the above characteristics are measurements of typical sample, they are not guaranteed. 60 80 100 120 140 160 180 200 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] power supply rejection ratio [db] -6 -4 -2 0 2 4 6 -1012345 input voltage [v] input offset voltage [mv] 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] common mode rejection ratio [db] 2v 5v 36v -40 25 125 0 1 2 3 4 5 -100 -80 -60 -40 -20 0 over drive voltage [mv] response time (low to high) [ s] 125 25 -40 figure 18. common mode rejection ratio vs ambient temperature figure 20. power supply rejection ratio vs ambient temperature figure 19. input offset voltage - input voltage (vcc=5v) figure 21. response time (low to high) vs over drive voltage (vcc=5v, v rl =5v, r l =5.1k ? )
tsz02201-0rfr0g200680-1-2 12/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued ba2903yf-lb (*)the above characteristics are measurements of typical sample, they are not guaranteed. 0 1 2 3 4 5 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] response time (low to high) [ s] 5mv overdrive 20mv overdrive 100mv overdrive 0 1 2 3 4 5 0 20406080100 over drive voltage [mv] response time (high to low) [ s] 125 25 -40 0 1 2 3 4 5 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] response time (high to low) [ s] 5mv overdrive 20mv overdrive 100mv overdrive figure 22. response time (low to high) vs ambient temperature (vcc=5v, v rl =5v, r l =5.1k ? ) figure 24. response time (high to low) vs ambient temperature (vcc=5v, v rl =5v, r l =5.1k ? ) figure 23. response time (high to low) vs over drive voltage (vcc=5v, v rl =5v, r l =5.1k ? )
tsz02201-0rfr0g200680-1-2 13/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued BA2901YF-LB (*)the above characteristics are measurements of typical sample, they are not guaranteed. 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature [c] power dissipation [w] 0 50 100 150 200 0 10203040 supply voltage [v] output saturation voltage [mv] -40 25 125 BA2901YF-LB figure 26. supply current vs supply voltage figure 27. supply current vs ambient temperature figure 25. power dissipation vs ambient temperature (derating curve) figure 28. output saturation voltage vs supply voltage (i sink =4ma) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0 10203040 supply voltage [v] supply current [ma] -40 25 125 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] supply current [ma] 2v 5v 36v
tsz02201-0rfr0g200680-1-2 14/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued BA2901YF-LB (*)the above characteristics are measurements of typical sample, they are not guaranteed. 0 10 20 30 40 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] output sink current [ma] 0 50 100 150 200 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] output saturation voltage [mv] 36v 5v 36v 5v 2v 2v figure 32. input offset voltage vs supply voltage figure 29. output saturation voltage vs ambient temperature (i sink =4ma) figure 30. output saturation voltage vs output sink current (vcc=5v) figure 31. output sink current vs ambient temperature (out=1.5v) 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 02468101214161820 output sink current [m a] output saturation voltage [v] -40 25 125 -8 -6 -4 -2 0 2 4 6 8 010203040 supply voltage [v] input offset voltage [mv] -40 25 125
tsz02201-0rfr0g200680-1-2 15/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued BA2901YF-LB (*)the above characteristics are measurements of typical sample, they are not guaranteed. 0 20 40 60 80 100 120 140 160 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] input bias current [na] -50 -40 -30 -20 -10 0 10 20 30 40 50 0 10203040 supply voltage [v] input offset current [na] 125 25 -40 2v 5v 36v -8 -6 -4 -2 0 2 4 6 8 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] input offset voltage [mv] 2v 5v 36v 0 20 40 60 80 100 120 140 160 0 10203040 supply voltage [v] input bias current [na] -40 25 125 figure 33. input offset voltage vs ambient temperature figure 34. input bias current vs supply voltage figure 35. input bias current vs ambient temperature figure 36. input offset current vs supply voltage
tsz02201-0rfr0g200680-1-2 16/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued BA2901YF-LB (*)the above characteristics are measurements of typical sample, they are not guaranteed. 60 70 80 90 100 110 120 130 140 0 10203040 supply voltage [v] large signal voltage gain [db] -50 -40 -30 -20 -10 0 10 20 30 40 50 -50-25 0 255075100125150 ambient temperature [c] input offset current [na] 2v 5v 36v 25 125 -40 60 70 80 90 100 110 120 130 140 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] large signal voltage gain [db] 15v 5v 36v 40 60 80 100 120 140 160 010203040 supply voltage [v] common mode rejection ratio [db] -40 25 125 figure 38. large signal voltage gain vs supply voltage figure 37. input offset current vs ambient temperature figure 40. common mode rejection ratio vs supply voltage figure 39. large signal voltage gain vs ambient temperature
tsz02201-0rfr0g200680-1-2 17/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued BA2901YF-LB (*)the above characteristics are measurements of typical sample, they are not guaranteed. 60 80 100 120 140 160 180 200 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] power supply rejection ratio [db] -6 -4 -2 0 2 4 6 -1012345 input voltage [v] input offset voltage [mv] 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] common mode rejection ratio [db] 2v 5v 36v -40 25 125 0 1 2 3 4 5 -100 -80 -60 -40 -20 0 over drive voltage [mv] response time (low to high) [ s] 125 25 -40 figure 41. common mode rejection ratio vs ambient temperature figure 43. power supply rejection ratio vs ambient temperature figure 42. input offset voltage - input voltage (vcc=5v) figure 44. response time (low to high) vs over drive voltage (vcc=5v, v rl =5v, r l =5.1k ? )
tsz02201-0rfr0g200680-1-2 18/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 typical performance curves - continued BA2901YF-LB (*)the above characteristics are measurements of typical sample, they are not guaranteed. 0 1 2 3 4 5 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] response time (low to high) [ s] 5mv overdrive 20mv overdrive 100mv overdrive 0 1 2 3 4 5 0 20406080100 over drive voltage [mv] response time (high to low) [ s] 125 25 -40 0 1 2 3 4 5 -50 -25 0 25 50 75 100 125 150 ambient temperature [c] response time (high to low) [ s] 5mv overdrive 20mv overdrive 100mv overdrive figure 45. response time (low to high) vs ambient temperature (vcc=5v, v rl =5v, r l =5.1k ? ) figure 47. response time (high to low) vs ambient temperature (vcc=5v, v rl =5v, r l =5.1k ? ) figure 46. response time (high to low) vs over drive voltage (vcc=5v, v rl =5v, r l =5.1k ? )
tsz02201-0rfr0g200680-1-2 19/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 power dissipation power dissipation (total loss) indicates the power that the ic can consume at t a =25c (normal temperature). as the ic consumes power, it heats up, causing its temperature to be higher than the ambient temperature. the allowable temperature that the ic can accept is limited. this depends on the circuit configuration, manufacturing process, and consumable power. power dissipation is determined by the allowable temperature within the ic (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capabilit y). maximum junction temperature is typically equal to the maximum storage temperature. the heat generated through the cons umption of power by the ic radiates from the mold resin or lead frame of the package. thermal resistance, represented by the symbol ja c/w, indicates this heat dissipation capability. similarly, the temperature of an ic inside its package can be estimated by thermal resistance. figure 48(a) shows the model of the thermal resistance of the package. the equation below shows how to compute for the thermal resistance ( ja ), given the ambient temperature (t a ), maximum junction temperature (t jmax ), and power dissipation (p d ). ja = (t jmax -t a ) / p d c/w the derating curve in figure 48(b) indicates the power that t he ic can consume with reference to ambient temperature. power consumption of the ic begins to attenuate at certain temperatures. this gradient is determined by thermal resistance ( ja ), which depends on the chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc. this may also vary even when the same of package is used. thermal reduction curve indicates a reference value measured at a specified condition. figure 48( c) and (d) shows an example of the derating curve for ba2903yf-lb, BA2901YF-LB. (note14) (note15) unit 6.2 4.5 mw/c when using the unit above t a =25c, subtract the value above per celsius degree. permissible dissipation is the value w hen fr4 glass epoxy board 70mm70mm1.6mm (copper foil area less than 3%) is mounted. (a) thermal resistance (b) derating curve figure 48. thermal resistance and derating (c) ba2903y (d) ba2901y ja =(t jmax -t a )/p d c /w 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature [c] power dissipation [w] 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature [c] power dissipation [w] ba2903yf-lb (note 14) BA2901YF-LB (note 15) a mbient temperature t a [ c ] chip surface temperature t j [ c ] 0 50 75 100 125 150 25 p1 p2 pd (max) lsi M [w] ' ja2 ' ja1 tj ' (m ax ) ja2 < ja1 ?? ta [ ] ja2 ja1 tj (m ax ) ?? lsi M p d(max) p d(max) ja2 < ja1 ? ja2 ja2 ? ja1 ja1 t a [ c ] t j?(max) t j(max) power dissipation of lsi ambient temperature
tsz02201-0rfr0g200680-1-2 20/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 application information null method condition for test circuit1 vcc,vee,e k ,v icm unit v parameter v f s1 s2 s3 vcc vee e k v icm calculation input offset voltage v f1 on on on 5 to 36 0 -1.4 0 1 input offset current v f2 off off on 5 0 -1.4 0 2 input bias current v f3 off on on 5 0 -1.4 0 3 v f4 on off 5 0 -1.4 0 large signal voltage gain v f5 on on on 15 0 -1.4 0 4 v f6 15 0 -11.4 0 - calculation - 1. input offset voltage (v io ) 2. input offset current (i io ) 3. input bias current (i b ) 4. large signal voltage gain (a v ) figure 49. test circuit1 (one channel only) v io |v f1 | = 1+r f /r s [v] |v f5 -v f6 | a v = e k (1+r f /r s ) [db] 20log = i b |v f4 -v f3 | 2 r i (1+r f /r s ) [a] i io |v f2 -v f1 | r i (1+r f /r s ) [a] = vcc r f =50k ? r i =10k ? 0.1f r s =50 ? r l sw2 500k ? 500k ? 0.1f e k 15v dut vee v rl 50k ? v icm sw1 0.1f r i =10k ? vo v f r s =50 ? 1000pf -15v null sw3
tsz02201-0rfr0g200680-1-2 21/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 switch condition for test circuit 2 sw no. sw 1 sw 2 sw 3 sw 4 sw 5 sw 6 sw 7 supply current off off off off off off off output sink current out=1.5v off on on off off off on output saturation voltage i sink =4ma off on on off on on off output leakage current out=36v off on on off off off on response time r l =5.1k ? , v rl =5v on off on on off off off figure 50. test circuit 2 (one channel only) figure 51. response time over drive voltag e v ref in t re ( low to hig h) out 0v vcc v ref in out input wave vcc/2 overdr ive voltag e input wave output wave output wave t re (hig h to low) 0v vcc vcc/2 sw2 sw5 a -in +in rl vcc vee sw4 sw3 sw6 sw7 a v out sw1 vrl
tsz02201-0rfr0g200680-1-2 22/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 example of circuit reference voltage is -in while the input voltage is higher that the reference voltage, the output voltage remains high. in case the input voltage becomes lower than the reference voltage, the output voltage will turn low. reference voltage is +in while the input voltage is smaller that the reference voltage, the output voltage remains high. in case the input voltage becomes higher than the reference voltage, the output voltage will turn low. reference voltage reference voltage vref in vrl out + - vcc vee + - in vref vee vcc vrl rl in time v ref out time high low time v ref low high time in out
tsz02201-0rfr0g200680-1-2 23/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic?s power supply terminals. 2. power supply lines design the pcb layout pattern to provide low impedance ground and supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in t he ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins. consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current gnd traces , the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the gnd tr aces of external components do not cause variations on the gnd voltage. the power supply and ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded, the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maxi mum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expect ed characteristics of the ic can be approximately obtained. the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capa citance, power wiring, width of gnd wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ic?s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground. inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few.
tsz02201-0rfr0g200680-1-2 24/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 + - vcc vee open v icm operational notes ? continued 11. regarding input pins of the ic this monolithic ic contains p+ isolation and p substrat e layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of th e p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. nn p + p nn p + p substrate parasitic element gnd n p + nn p + n p p substrate gnd gnd parasitic element pin a pin a pin b pin b bc e parasitic element gnd parasitic element or transistor parasitic element c b e transistor (npn) resistor figure 52. example of monolithic ic structure 12. unused circuits when there are unused circuits it is recommended that they be connected as in figure 53, setting the non-inverting input terminal to a potential within the in-phase input voltage range (v icr ). figure 53. disable circuit example 13. input terminal voltage applying vee + 36v to the input terminal is possible without causing deterioration of the electrical characteristics or destruction, irrespective of the supply voltage. however, this does not ensure normal circuit operation. please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. 14. power supply (signal / dual) the comparator operates when t he specified voltage supplied is between v cc and vee. therefore, the single supply comparator can be used as a dual supply op-amp as well. 15. terminal short-circuits when the output and vcc terminals are shorted, excessive output current may flow, resulting in undue heat generation and, subsequently, destruction. 16. ic handling applying mechanical stress to the ic by deflecting or bending the board may cause fluctuations in the electrical characteristics due to piezo resistance effects. keep this potential in v icm
tsz02201-0rfr0g200680-1-2 25/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 physical dimensions tape and reel information package name sop8 max 5.35 (include. burr) drawing: ex112-5001-1
tsz02201-0rfr0g200680-1-2 26/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 physical dimension tape and reel information - continued package name sop14 (unit : mm) pkg : sop14 drawing no. : ex113-5001 (max 9.05 (include.burr))
tsz02201-0rfr0g200680-1-2 27/27 30.jan.2014 rev.001 ba2903yf-lb BA2901YF-LB datasheet ? 2014 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 marking diagrams land pattern data all dimensions in mm pkg land pitch e land space mie land length R? 2 land width b2 sop8 sop14 1.27 4.60 1.10 0.76 revision history date revision changes 30.jan.2014 001 new release product name package type marking ba2903y f-lb sop8 2903y ba2901y f-lb sop14 ba2901yf sop8(top view) part number marking lot number 1pin mark sop14(top view) part number marking lot number 1pin mark b 2 mie e ?2 sop8, sop14
datasheet datasheet notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class classb class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet datasheet notice - ss rev.002 ? 2014 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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